SÜSS MicroTec SE
Senior Application Engineer - Bonder (m/f/d)
Publiziert am: 7/1/26 | Hsinchu | Vollzeit
Jetzt bewerben- Education of Master or beyond in engineering background for Physics, Optics, Material Science, Mechanical Engineering, Electrical Engineering
- 8+ years of proven experience in wafer fab working, specifically in 3D wafer process engineering or field applications
- Deep technical proficiency with chip/wafer bonder/de-bonder and sophistic knowledge with 3D semiconductor or advanced packaging domains
- Demonstrated experience in managing complex projects or tasks
- Analytical skills, self-motivated, resilience characteristics with good accountability
Qualifications
- Lead and drive the qualification, process development, trouble-shooting, characterization of advanced chip/wafer bonding/de-bonding processes for SUSS products to ensure competitive edge of processes performance for customer demands in the domain fields of 3D advanced semiconductor, e.g. SoIC, CoWoS, InFO, BSPDN
- Improve the yield of process characteristics by analyzing process symptom data and performing for expertise documentation of technique to conduct 3D processes enhancement for sophisticated technical projects and events
- Act as the primary point of contact for on field key customers, manage multi-disciplinary projects and technical tasks of R&D or HVM from concept to completion, ensuring milestones on time and within planning scope
- Co-worker with the team to cultivate the continuous BKM techniques knowledge stewardship, accelerating the team's technical proficiency
- Take accountability and ownership of critical tasks and projects assigned by supervisor
SÜSS MicroTec SE
Schleißheimer Str. 90
85748 Garching
Schleißheimer Str. 90
85748 Garching
