Onsite Technical Manager

 Degree in Engineering/Science from a recognized university

Minimum 5 years of related work experience in Temporary Bonding wafer process engineering or similar.

Self-driven and strong team player with keen technical ability, systematic approach, detailed-oriented, excellent problem solving skills, and positive attitude.

Ability to work independently, be hands-on and expected to dive into technical details as required to cover thinly-resourced areas.

 Ability to work on a fast-paced and challenge work environment.

Good interpersonal and communication skills.

To ensure the onsite team on Shopfloor safety / discipline

To provide Onsite support for advanced troubleshooting

To provide Technical support for onsite Service Manager during customer and HQ calls

Support onsite Service Manager to identify training deficiencies

Morning meeting with customer team and bring back the assigned issues

Mentor Team Leads